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The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
- Sales Rank: #578623 in Books
- Published on: 2014-01-07
- Original language: English
- Number of items: 1
- Dimensions: 9.50" h x 1.44" w x 7.70" l, 2.40 pounds
- Binding: Hardcover
- 576 pages
About the Author
Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. He is the principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry. Van Zant’s books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers have included Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions.
Most helpful customer reviews
3 of 3 people found the following review helpful.
Admirably broad view, spoiled by uncorrected errors and erratic updating.
By John G. Bennett
This is a 6th edition but the updating is erratic. There are many sections where you will see the discussion of methods end with 0.35 micron processes. Yes, other sections go further, but it leaves you guessing about the usefulness of the information. There are also places where there are typos and diagrams with wrong labels that must have been there for a decade. I don't feel at all like I understand how a 22nm process works, or even 65 nm. For example the thinnest spin-on coating discussed is about 10x thicker than what I see discussed in research papers and you will not find any clue how that is achieved.
As an introductory text it has the advantage of giving you an all-around view of how complicated the industry is. You will find discussions of everything from coating your shoes to coating high aspect contacts, from super pure chemicals to super-small self aligned processes. At the end of the book you probably know most of the processes in use.
You will, however, probably not feel confident you have learned how the most modern chips are produced. This book requires a total overhaul if it is to remain relevant, now just tinkering.
1 of 1 people found the following review helpful.
Three Stars
By Yeong-Cheol Kim
This book is OK, but there are many typos and some wrong information in the book.
0 of 0 people found the following review helpful.
Great overview of the wafer fab process
By Terrance Barker
Almost through chapter 6. Great overview of the wafer fab process. Reads easily.
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